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Berliner Glas
PHOTONICS SYSTEMS PHOTONICS SYSTEMS
TECHNICAL GLASS TECHNICAL GLASS
COMPANY COMPANY
APPLICATION APPLICATION
Semiconductor Semiconductor
Biotechnology & medicine Biotechnology & medicine
Industrial sensors Industrial sensors
Information technology Information technology
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Semiconductor

market

angiograph biotechnology

Biotechnology

& medicine

Industrial sensors - Airborne camera system

Industrial

sensors

Information Technology Objective

Information

technology

Industrial Sensors

optomechanical assembly / optomechanische Baugruppe
Optical system for 3-D measurement
We provide optical components, opto-mechanical assemblies or electro-optical modules for photogrammetry and industrial sensing, geodesy, distance measurement or mobile 3D measuring technologies.

The growing miniaturization, i.e. the storage technology on data media, requires high-resolution optical measuring- and analysis systems.
Automatic optical inspections, positioning systems and temperature measurements are tasks for our optical modules and components wherever it comes to precision control.

Our complex optics are used by the most modern aerial view cameras or analytical instruments and whereelse100% precision are required.

Precision key components e.g. holographic gratings are offered for high end spectroscopy industries such as

Instrumente zur Spektralanalyse / Spectro Analytical Instuments
SPECTRO Analytical Instruments.


MEMS Packaging

Berliner Glas offers higly-precise, structured glass wafers for the waferlevel-packaging of MEMS and - additionally equipped with optical windows - for encapsulation of  MOEMS.

With different manufacturing processes, we offer an economically and insdustrially useful waafelevel encapsulation solution with important benefits for the customer for a broad range of  MEMS, RF-MEMS and MEOMS.

Advantages:

  • Thermal coefficient of expansion adapted to the SI-Wafer
  • Great amount of freedom for designing the cavities, even non-uniform depths
  • tight form an dposition tolerances
  • very plano and parallel surfaces, low levels of roughness
  • ready-to-bond
  • alignment marks

Various applications can be found where micro-electro-mechnical systems are used.


Reinraummontage / cleanroom mounting
APPLICATION
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MEMS Waferlevel Packaging

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