Berliner Glas offers higly-precise, structured glass wafers for the waferlevel-packaging of MEMS and - additionally equipped with optical windows - for encapsulation of MOEMS.
With different manufacturing processes, we offer an economically and insdustrially useful waafelevel encapsulation solution with important benefits for the customer for a broad range of MEMS, RF-MEMS and MEOMS.
Advantages:
- Thermal coefficient of expansion adapted to the SI-Wafer
- Great amount of freedom for designing the cavities, even non-uniform depths
- tight form an dposition tolerances
- very plano and parallel surfaces, low levels of roughness
- ready-to-bond
- alignment marks
Various applications can be found where micro-electro-mechnical systems are used.