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Electrostatic and Vacuum Wafer Chucks

BG Chuck

BERLINER GLAS supports the semiconductor industry with innovative chucks for the various processing steps of chip-manufacturing.

Reliable chucking systems – electrostatic chucks or vacuum chucks – encompass significant advantages such as integrated cooling/heating systems and single sided or double sided chucking with structures custom tailored to our customer’s requirements.

With extremely high flatness and very low parallelism deviation, BERLINER GLAS provides the industry with ultra fast chucking

solutions for highest yield and the ultimate benefit for high power fab equipment.

With many years of experience in electrostatic and vacuum chucking solutions for semiconductor lithography process, BERLINER GLAS is one of the companies supporting EUV lithography.

	Vacuum and Electrostatic chucks	Electrostatic Chucks	Vacuum chucks
Chuck structure	Wafer chucks for up to 12 inch wafer size Reticle chucks Single sided or double sided chucking Integrated water cooling (optional) Integrated electrical heating (optional)	up to eight electrodes per side Unipolar or multipolar electrodes	up to four separated vacuum segments
Flatness	Global flatness down to 100 nm across 300 mm Local flatness of down to 2 µrad local angle Local flatness across a die is within a few nanometers
Chuck force	Uniform clamping force between part and chuck across chuck area	up to 0.5 bar Down to 0.1 seconds chucking and de-chucking time Down to 1 mW electric power dissipation per 12 inch area	up to 1 bar Very low vacuum flow due to vacuum seals
Material option	"Zero"-expansion materials like Zerodur, ULE & Cordierite near-Silicon expansion materials like Silicon-Carbide, Silicon-Nitride, SiSiC & Borosilicate glass Tailored thermal conductivity by use of different chuck materials High stiffness of up to 260 GPa (41 MPsi) Wear resisitant surface on sensitive base materials by special coatings All materials are low outgassing and extremly pure	High resistance materials allow short chucking time High voltage breakthrough threshold materials allow high clamping force
Microstructures	Burl or ring structures minimize sticking force during de-chucking Contact area reduction by a factor of 100 by uniform or non-uniform distributed burls Burl dia down to 50 µm Low abrasion on burls by protective coating on top of burl Easy cleaning and reduced contamination sensitivity by microstructures
Test & Qualification	Functional tests in a stack and direct measurement Use of high precision reference wafers and reference reticles Advanced chuck and wafer cleaning to prove flatness's of 100 nm global and 2 µrad local Phase shifting interferometers up to 24" with horizontal beam and 12" vertical beam Custom software for application specific local flatness evaluation available	High voltage functional electrical test	Vacuum flow test


	PHOTONICS+SYSTEMS

Contact

chucks@berlinerglas.de

Downloads

Wafer Chucks Datasheet

Download 966 KB

Electrostatic and Vacuum Wafer Chucks

Wafer Chucks Datasheet Download 966 KB

Wafer Chucks Datasheet

Download 966 KB