WLP with optical windows

2003-11-01

BERLINER GLAS manufactures highly-precise, structured glass wafers for the WLP of MEMS.

Encapsulation wafers with complex structures can be manufactured with a high level of precision at relatively low cost with an innovative manufacturing process. Glass wafers made of borosilicate glass in a size of up to 8" can be provided with the following features:

. Thermal coefficient of expansion adapted to the Si wafer
. A great amount of freedom for designing the cavities, even non-uniform depths
. Integration of defined, open areas (openings)
. Integration of optical windows for use with MO EMS
. Integration of metallic through-contacts (vias) for increasing the packing density (in planning)
. Tight form and position tolerances
. Very plane and parallel, low level of roughness
. Ready-to-bond (metal bond, anodic bond etc.)
. Alignment marks

BERLINER GLAS is offering an economical and industrially useful wafer-level encapsulation solution with important benefits for the customer with this product for a broad range of MEMS, RF-MEMS and MO EMS.