• Chucks for wafers up to 450 mm (18 inch)
• Chucks for reticles
• Customer-specific formats up to 400 x 500 mm²
• Single or double-sided clamps
• Exact temperatures up to small mK
• Integrated heating and cooling functions (options)
• Hybrid chucks (ESC & vacuum chuck combined)
• Wide range of functional surface coatings

ESC specific:

• Coulomb type with up to 8 electrodes per side
• Single or multi-polar electrodes (mono- and bipolar systems)

Vacuum chuck specific:

• Up to 4 separate vacuum segments
• Supports both rotating as well as lateral platforms

• Global flatness up to 100 nm PV (D=298 mm)
• Local flatness us to 10 nm PV (20x20 mm²)
• Specific flatness needs according to application possible

• Absorption of warped wafers
• Flatten warped wafers
• Controlled adjustment of wafer shapes

Homogeneous clamping force over the entire clamp surface

• Up to 0.5 bar of clamping pressure for ESCs and up to 1 bar for vacuum chucks
• Time constants to hold and release smaller than 0.1 seconds

• Chuck materials with silicon-adapted properties
• Materials with "zero expansion"
• Materials with high stiffness
• Materials with high thermal conductivity and abrasion resistance
• Combination of various materials to ensure the highest performance
• All materials satisfy the semiconductor standard

Pin structures reduce the contact surface of the wafer to the chuck by a factor of 100 (1 % of contact surface)

• No sticking between wafer and chuck
• Very low particle sensitivity
• Pin size up to 300 µm in diameter

In our laboratory, we qualify test parts as well as measurement and reference parts and conduct test series in order to guarantee successful volume production.

Possible qualifications:

• Flatness measurement using interferometer (up to 24 inches horizontal and 12 inches vertical beam path)
• Customer-specific software for a very accurate evaluation of flatness
• Electrical qualification in an application-oriented environment (high voltage test)
• Measurement of clamping force
• Residual gas analysis (RGA)
• Backside contamination analyses
• Flow-through tests for coolants and gas