Development competencies

Chuck Design. Solutions for High-Performance Applications.

Berliner Glas develops innovative chuck solutions for the most diverse and demanding processing steps in the semiconductor industry.

  • Vacuum Chucks
  • Electrostatic Chucks (ESCs)

For more information about our approach, our expertise and our new test center to shorten development cycles please click here.

Chuck Design

  • Chucks for wafers up to 450 mm (18 inch)
  • Chucks for reticles
  • Customer-specific formats up to 400 x 500 mm²
  • Single or double-sided clamps
  • Exact temperatures up to small mK
  • Integrated heating and cooling functions (options)
  • Hybrid chucks (ESC & vacuum chuck combined)
  • Wide range of functional surface coatings
E-chuck with features

Chuck design (ESC) with features

ESC specific:

  • Coulomb type with up to 8 electrodes per side
  • Single or multi-polar electrodes (mono- and bipolar systems)

Vacuum chuck specific:

  • Up to 4 separate vacuum segments
  • Supports both rotating as well as lateral platforms


  • Global flatness up to 100 nm PV (D=298 mm)
  • Local flatness us to 10 nm PV (20x20 mm2)
  • Specific flatness needs according to application possible
sample screen for measuring the flatness of a chuck

Global flatness < 100nm to 298mm

Shape Control

  • Absorption of warped wafers
  • Flatten warped wafers
  • Controlled adjustment of wafer shapes

Clamping Pressure

Homogeneous clamping force over the entire clamp surface

  • Up to 0.5 bar of clamping pressure for ESCs and up to 1 bar for vacuum chucks
  • Time constants to hold and release smaller than 0.1 seconds


MetalAluminium with coating
CeramicsSiC, SiSiC
AlN, Si3N4
Glass & GlassceramicsBorosilicate Glass
Quartz Glass
ULE®, Zerodur®
Metal Ceramics Glass & Glassceramics
Aluminium with coating SiC, SiSiC
AlN, Si3N4
Borosilicate Glass
Quartz Glass
ULE®, Zerodur®


  • Chuck materials with silicon-adapted properties
  • Materials with "zero expansion"
  • Materials with high stiffness
  • Materials with high thermal conductivity and abrasion resistance
  • Combination of various materials to ensure the highest performance
  • All materials satisfy the semiconductor standard
Electrostatic chuck with integrated cooling

Electrostatic chuck made from glass and ceramic


Pin structures reduce the contact surface of the wafer to the chuck by a factor of 100 (1 % of contact surface)

  • No sticking between wafer and chuck
  • Very low particle sensitivity
  • Pin size up to 300 µm in diameter
E-Chuck with pin structure

Pin structure of an electrostatic chuck

Testing & Qualifi­cation

In our laboratory, we qualify test parts as well as measurement and reference parts and conduct test series in order to guarantee successful volume production.

Possible qualifications:

  • Flatness measurement using interferometer (up to 24 inches horizontal and 12 inches vertical beam path)
  • Customer-specific software for a very accurate evaluation of flatness
  • Electrical qualification in an application-oriented environment (high voltage test)
  • Measurement of clamping force
  • Residual gas analysis (RGA)
  • Backside contamination analyses
  • Flow-through tests for coolants and gas
Measurement using a 24 inch interferomter

Measurement on the interferometer


Data sheet

Vacuum Chuck

Data sheet

Electrostatic Chuck

Right of retraction

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Berliner Glas GmbH
Waldkraiburger Straße 5
12347 Berlin, Germany

Phone +49 30 60 905-0
info [at]


Contact details