Chuck Design.

• Chucks for wafers up to 450 mm (18 inch)
• Chucks for reticles
• Customer-specific formats up to 400 x 500 mm²
• Single or double-sided clamps
• Exact temperatures up to small mK
• Integrated heating and cooling functions (options)
• Hybrid chucks (ESC & vacuum chuck combined)
• Wide range of functional surface coatings

• Global flatness up to 100 nm PV (D=298 mm)
• Local flatness us to 10 nm PV (20x20 mm²)
• Specific flatness needs according to application possible

Homogeneous clamping force over the entire clamp surface

• Up to 0.5 bar of clamping pressure for ESCs and up to 1 bar for vacuum chucks
• Time constants to hold and release smaller than 0.1 seconds

• Chuck materials with silicon-adapted properties
• Materials with "zero expansion"
• Materials with high stiffness
• Materials with high thermal conductivity and abrasion resistance
• Combination of various materials to ensure the highest performance
• All materials satisfy the semiconductor standard

Pin structures reduce the contact surface of the wafer to the chuck by a factor of 100 (1 % of contact surface)

• No sticking between wafer and chuck
• Very low particle sensitivity
• Pin size up to 300 µm in diameter

Possible qualifications:

• Flatness measurement using interferometer (up to 24 inches horizontal and 12 inches vertical beam path)
• Customer-specific software for a very accurate evaluation of flatness
• Electrical qualification in an application-oriented environment (high voltage test)
• Measurement of clamping force
• Residual gas analysis (RGA)
• Backside contamination analyses
• Flow-through tests for coolants and gas