Development competencies
Chuck Design.
Solutions for High-Performance Applications.

Berliner Glas develops innovative chuck solutions for the most diverse and demanding processing steps in the semiconductor industry.

  • Vacuum Chucks
  • Electrostatic Chucks (ESCs)

For more information about our approach, our expertise and our new test center to shorten development cycles please click here.

Chuck Design

  • Chucks for wafers up to 450 mm (18 inch)
  • Chucks for reticles
  • Customer-specific formats up to 400 x 500 mm²
  • Single or double-sided clamps
  • Exact temperatures up to small mK
  • Integrated heating and cooling functions (options)
  • Hybrid chucks (ESC & vacuum chuck combined)
  • Wide range of functional surface coatings
E-chuck with features

Chuck design (ESC) with features

ESC specific:

  • Coulomb type with up to 8 electrodes per side
  • Single or multi-polar electrodes (mono- and bipolar systems)

Vacuum chuck specific:

  • Up to 4 separate vacuum segments
  • Supports both rotating as well as lateral platforms

Flatness

  • Global flatness up to 100 nm PV (D=298 mm)
  • Local flatness us to 10 nm PV (20x20 mm2)
  • Specific flatness needs according to application possible
sample screen for measuring the flatness of a chuck

Global flatness < 100nm to 298mm

Shape Control

  • Absorption of warped wafers
  • Flatten warped wafers
  • Controlled adjustment of wafer shapes

Clamping Pressure

Homogeneous clamping force over the entire clamp surface

  • Up to 0.5 bar of clamping pressure for ESCs and up to 1 bar for vacuum chucks
  • Time constants to hold and release smaller than 0.1 seconds

Material

MetalAluminium with coating
CeramicsSiC, SiSiC
AlN, Si3N4
Al2O3
Cordierit
Glass & GlassceramicsBorosilicate Glass
Quartz Glass
ULE®, Zerodur®
Metal Ceramics Glass & Glassceramics
Aluminium with coating SiC, SiSiC
AlN, Si3N4
Al2O3
Cordierit
Borosilicate Glass
Quartz Glass
ULE®, Zerodur®

 

  • Chuck materials with silicon-adapted properties
  • Materials with "zero expansion"
  • Materials with high stiffness
  • Materials with high thermal conductivity and abrasion resistance
  • Combination of various materials to ensure the highest performance
  • All materials satisfy the semiconductor standard
Electrostatic chuck with integrated cooling

Electrostatic chuck made from glass and ceramic

Micro­structure

Pin structures reduce the contact surface of the wafer to the chuck by a factor of 100 (1 % of contact surface)

  • No sticking between wafer and chuck
  • Very low particle sensitivity
  • Pin size up to 300 µm in diameter
E-Chuck with pin structure

Pin structure of an electrostatic chuck

Testing & Qualifi­cation

In our laboratory, we qualify test parts as well as measurement and reference parts and conduct test series in order to guarantee successful volume production.

Possible qualifications:

  • Flatness measurement using interferometer (up to 24 inches horizontal and 12 inches vertical beam path)
  • Customer-specific software for a very accurate evaluation of flatness
  • Electrical qualification in an application-oriented environment (high voltage test)
  • Measurement of clamping force
  • Residual gas analysis (RGA)
  • Backside contamination analyses
  • Flow-through tests for coolants and gas
Measurement using a 24 inch interferomter

Measurement on the interferometer

Contact our specialists

Please choose your contact partner:

Kontakt Icon
Beate Baumgarten
Laser Annealing, Laser Material Processing, Customer Specified Coatings
Fon +49 30 60 905-277
Kontakt zu Berliner Glas
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Downloads

Data sheet

Vacuum Chuck

Data sheet

Electrostatic Chuck

Right of retraction

You can revoke the use of your data anytime via email to marketing@berlinerglas.de, via fax, or via post. If you have any other questions, you can reach our data protection staff at datenschutz@berlinerglas.de.

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Berliner Glas KGaA Herbert Kubatz GmbH & Co.
Waldkraiburger Straße 5
12347 Berlin, Germany

Fon +49 30 60 905-0
info [at] berlinerglas.de

 

Contact details