berliner glas - optical modules for your products

Chucks & Precise Structural Components.

High Precise and Versatile.

The electrostatic chucks (ESCs or echucks) and vacuum chucks we design and manufacture are used in many sectors within the semiconductor industry. Their function is to pick up a wafer, hold it, align it, maintain a standard temperature and release the wafer after the processing step without damaging it or contaminating it in a major way.
 
Our portfolio also includes precise structural components, such as high precise mirror blocks and metrology frames with mirrors and measurement surfaces. Our customer-specific light-weight structures with high stiffness and the best flatness allow us to optimize functionality for dynamic processes in the production of semiconductors.
 
You can find specifications about the chuck solutions developed in Berlin under Chuck Design.

Our key components

Electrostatic Chucks

We provide electrostatic chucks for wafers up to 450 mm in diameter with customer-specific designs made from various materials. The echucks use an electrostatic field under vacuum conditions in order to constrain electrically conductive substrates (e. g. silicon wafers) as well as glass. You can find more information about our development expertise in the chuck design section.

Specifications

Size/geometryup to 450 mm (18 inches)
MaterialsMetals (aluminium with coating), ceramics (SiC, SiSiC, AlN, Si3N4, Al2O3, cordierite), glass and ceramics (borosilicate, quartz glass, ULE®, Zerodur®)
DesignCustomer-specific (e. g. light-weight structure, interior cooling channels, heating filaments...)
Electrode designMonopolar, bipolar, customer-specific structures (e. g. finger structure)   
Surface structuringCustomer-specific pin & seal designs (optimized flatness/contact surface upon request)
Flatness

Global flatness: up to 100 nm PV (D=298 mm)

Local flatness: up to 10 nm (20x20 mm2)
Clamping/declamping timeup to 0.1 s (depends on clamping length, dielectric, temperature)
Clamping forceTypically up to 500 mbar
Operational temperature

-30 C to 600 C (depends on material)

Surface roughnessup to Ra < 1 nm (depends on material)
Tempering/coatingCustomer-specific layer designs for wear protection and/or particle reduction

Testing & qualification

Geometric testingInterferometer (measurements in stack with substrate) and coordinate measuring machines
Electric testingCapacitiy and high-voltage resistance tests
Functional testingStack measurements, backside gas leakage, resistance tests, residual gas analysis (RGA)
Computer analysisFEA (e. g. modal analysis)

 

For additional information on the technical details and specifications, please refer to our data sheet

 

Electrostatic Chuck.
 
Our electrostatic chucks are used in the following areas:

  • Lithography (EUV, DUV, VIS)
  • Inspection (e-beam)
  • Metrology
  • 3-D-packaging
  • Coating (OLED)
  • Bonding technologies
  • Display manufacture
  • Wafer handling
  • High temperature applications up to 600 C


An intelligent electric controller considerably improves the clamping and declamping performance of the echucks. This controller allows the user to determine the best possible progression of the voltage and remain exact via the supportive automatic control. To do so, the necessary control parameters are recorded with high accuracy and can be optimized depending on the application.

Vacuum Chucks

We design and manufacture vacuum chucks (up to 450 mm) from various materials like ceramics and glass ceramics for whatever specific application you have. Our vacuum chucks are employed under atmospheric conditions and stand out due to their application-optimized flatness (up to < 100 nm), high holding force, high temperature stability and high stiffness.

Specifications

Size/geometryup to 450 mm (18 inch)
MaterialsMetals (aluminium with coating), ceramics (SiC, SiSiC, AlN, Si3N4, Al2O3, cordierite), glass and glass ceramics (borosilicate glass, quartz glass, ULE®, Zerodur®)
DesignCustomer-specific (e. g. light-weight structure, interior cooling channels, heating filament...) 
Vacuum designMultiple and separated vacuum segments available
Surface structuringCustomer-specific pin & seal designs (optimized flatness/contact surface upon request)
Flatness

Global flatness: up to 100 nm PV (D=298 mm)

Local flatness: up to 10 nm (20x20 mm2)
Clamping forceup to 1 bar
Operational temperature

-30 C to 600 C (depends on material)

Surface roughnessup to Ra <1 nm (depends on material)
Tempering/coatingCustomer-specific layer designs for wear protection and/or particle reduction

Testing & qualification

Geometric testingInterferometer (measurements in stack with substrate) and coordinate measuring machines
Functional testingStack measurements, resistance tests, leakage tests, residual gas analysis (RGA)
Computer analysisFEA (e. g. modal analysis)

 

We can also integrate cooling and heating functions as well as light-weight structures upon request.
 
Our vacuum chucks are used in the following areas:

  • Lithography
  • Inspection
  • Metrology
  • Bonding technologies
  • Wafer handling
     
Precise Structural Components

Berliner Glas produces structural components with CNC techniques and offers many different options to shape glass, glass ceramics and ceramics. These structural components provide excellent stiffness, the best flatness and individual light-weight structures.
 
This process allows us to create, with the highest degree of accuracy, contours made up of lines, curves or other arbitrary shapes that run together. This opens new pathways in functional design. We are also able to conduct the high precise installation work for fixtures on these structural components using our expansive experience and expertise in installation and tool design.
 
 

 

Gewichtsreduzierung durch Leichtgewichtsstrukturen Berliner Glas
Weight reduction via light-weight structures

Mirror and measurement surfaces

 

High precise mirror blocks and metrology frames with mirror and measurement surfaces allow us to precisely determine the position of components.

 

Light-weight designs provide considerably better performance in dynamic processes.

Specifications

Size/geometryMax. 2,100x1,800x1,200 mm
MaterialsGlass ceramics (e. g. Zerodur), cordierite. SiSiC, borosilicate glass, quartz glass
Flatness

Global flatness: up to 200 nm PV (800x800 mm)

Local flatness: up to 2 µrad (26x32 mm2)
Reflectivity of the mirror layersUp to >95 %
Squareness of the mirror surfacesUp to 5 µrad
DesignLight-weight, installation of fixtures (adhesive, optical contact bonding, anodic bonding)

Test & qualification

Geometric testingInterferometer (e. g. mirror surfaces) and coordinate measuring machines
Computer analysisFEA (e. g. modal analysis)

Contact our specialists

Please choose your contact partner, contact us directly using our contact form or let us call you back.

Semiconductor Industry
Sven Götze
Fon +49 30 60 905-4818
sven.goetze [at] berlinerglas.de
US Office for Photonics
Kevin Liddane
Fon +1 714 389-1756
kliddane [at] berlinerglasus.com

Let us call you back!

Callback request

Downloads

technical data e-chuck for high flatness / specifications electrostatic chuck
Data sheet

Electrostatic Chuck

(250 KB)

technical data vacuum chuck / specifications vacuum chuck
Data sheet

Vacuum Chuck

(566 KB)

technische Daten Strukturbauteile / specifications light-weight structure / structural components
Data sheet

Structural Components

(338 KB)