The electrostatic chucks (ESCs) and vacuum chucks we design and manufacture are used in many sectors within the semiconductor industry. Their function is to pick up a wafer, hold it, align it, maintain a standard temperature and release the wafer after the processing step without damaging it or contaminating it in a major way.
Our portfolio also includes highest precision components, such as high precise mirror blocks and metrology frames with mirrors and measurement surfaces. Our customer-specific light-weight structures with high stiffness and the best flatness allow us to optimize functionality for dynamic processes in the production of semiconductors.
You can find specifications about the chuck solutions developed in Berlin under Chuck Design.
Electrostatic Chucks
We provide electrostatic chucks for wafers up to 450 mm in diameter with customer-specific designs made from various materials. The ESCs use an electrostatic field under vacuum conditions in order to constrain electrically conductive substrates (e. g. silicon wafers) as well as glass. You can find more information about our development expertise in the chuck design section.
Specifications & Properties
| Size / geometry |
up to 450 mm (18 inches) |
|---|---|
| Materials | Metals (aluminium with coating), ceramics (SiC, SiSiC, AlN, Si3N4, Al2O3, cordierite), glass and ceramics (borosilicate, quartz glass, ULE®, Zerodur®) |
| Design | Customer-specific (e. g. light-weight structure, interior cooling channels, heating filaments ...) |
| Electrode design | Monopolar, bipolar, customer-specific structures (e. g. finger structure) |
| Surface structuring | Customer-specific pin & seal designs (optimized flatness/contact surface upon request) |
| Flatness | Global flatness: up to 100 nm PV (D=298 mm) Local flatness: up to 10 nm (20x20 mm2) |
| Warped wafer chucking | Absorption of warped wafers and flatten warped wafers up to 5 mm wafer freeform |
| Shape control | Controlled adjustment of wafer shapes possible |
| Clamping / declamping time | up to 0.1 s (depends on clamping length, dielectric, temperature) |
| Clamping pressure | Typically up to 500 mbar |
| Operational temperature | -30 °C bis 600 °C (depends on material) |
| Surface roughness | up to Ra < 1 nm (depends on material) |
| Tempering / coating | Layers for wear protection and/or surface discharge (TiN, CrN, Al2O3, ...) and/or customer-specific coating design |
Testing & qualification
| Geometric testing | Interferometer (measurements in stack with substrate) and coordinate measuring machines |
|---|---|
| Electric testing | Capacitiy and high-voltage resistance test |
| Functional testing | Stack measurements, backside gas leakage, resistance tests, residual gas analysis (RGA) |
| Computer analysis | FEA (e. g. modal analysis) |
For additional information on the technical details and specifications, please refer to our data sheet
Electrostatic Chuck
Our electrostatic chucks are used in the following areas:
- Lithography (EUV, DUV, VIS)
- Inspection (e-beam)
- Metrology
- 3-D-packaging
- Coating (OLED)
- Bonding technologies
- Display manufacture
- Wafer handling
- High temperature applications up to 600 ◦C
Vacuum Chucks
We design and manufacture vacuum chucks (up to 450 mm) from various materials like ceramics and glass ceramics for whatever specific application you have. Our vacuum chucks are employed under atmospheric conditions and stand out due to their application-optimized flatness (up to < 100 nm), high holding force, high temperature stability and high stiffness.
Specifications & Properties
| Size / geometry | up to 450 mm (18 inch) |
|---|---|
| Materials | Metals (aluminium with coating), ceramics (SiC, SiSiC, AlN, Si3N4, Al2O3, cordierite), glass and glass ceramics (borosilicate glass, quartz glass, ULE®, Zerodur®) |
| Design | Customer-specific (e. g. light-weight structure, interior cooling channels, heating filament ...) |
| Vacuum design | Multiple and separated vacuum segments available |
| Surface structuring | Customer-specific pin & seal designs (optimized flatness/contact surface upon request) |
| Flatness | Global flatness: up to 100 nm PV (D=298 mm) Local flatness: up to 10 nm (20x20 mm2) |
| Warped wafer chucking | Absorption of warped wafers and flatten warped wafers up to 5 mm wafer freeform |
| Shape control | Controlled adjustment of wafer shapes possible |
| Clamping pressure | up to 1 bar |
| Operational temperature | -30 ◦C to 600 ◦C (depends on material) |
| Surface roughness | up to Ra <1 nm (depends on material) |
| Tempering / coating | Layers for wear protection particle reduction (TiN, CrN, DLC, SiC) and/or customer-specific layer designs |
Testing & qualification
| Geometric testing | Interferometer (measurements in stack with substrate) and coordinate measuring machines |
|---|---|
| Functional testing | Stack measurements, resistance tests, leakage tests, residual gas analysis (RGA) |
| Computer analysis | FEA (e. g. modal analysis) |
We can also integrate cooling and heating functions as well as light-weight structures upon request.
Our vacuum chucks are used in the following areas:
- Lithography
- Inspection
- Metrology
- Bonding technologies
- Wafer handling
Precision Components
Berliner Glas produces structural precision components with CNC techniques and offers many different options to shape glass, glass ceramics and ceramics. These structural precision components provide excellent stiffness, the best flatness and individual light-weight structures.
This process allows us to create, with the highest degree of accuracy, contours made up of lines, curves or other arbitrary shapes that run together. This opens new pathways in functional design. We are also able to conduct the high precise installation work for fixtures on these structural components using our expansive experience and expertise in installation and tool design.
Mirror and measurement surfaces
High precise mirror blocks and metrology frames with mirror and measurement surfaces allow us to precisely determine the position of components.
Light-weight designs provide considerably better performance in dynamic processes.
Weight reduction via light-weight structures
Specifications
| Size / geometry | Max. 2,100 x 1,800 x 1,200 mm |
|---|---|
| Materials | Glass ceramics (e. g. Zerodur), cordierite. SiSiC, borosilicate glass, quartz glass |
| Flatness |
Global flatness: up to 200 nm PV (800x800 mm) Local flatness: up to 2 µrad (26x32 mm2) |
| Reflectivity of the mirror layers | Up to >95 % |
| Squareness of the mirror surfaces | Up to 5 µrad |
| Design | Light-weight, installation of fixtures (adhesive, optical contact bonding, anodic bonding) |
Test & qualification
| Geometric testing | Interferometer (e. g. mirror surfaces) and coordinate measuring machines |
|---|---|
| Computer analysis | FEA (e. g. modal analysis) |
Contact our specialists
Please choose your contact partner:
Let us call you back!
Berliner Glas KGaA Herbert Kubatz GmbH & Co.
Waldkraiburger Straße 5
12347 Berlin, Germany
Fon +49 30 60 905-0
info [at] berlinerglas.de