Chucks & Precision Components
Chucks & Precision Components.
High Precise and Versatile.

The electrostatic chucks (ESCs) and vacuum chucks we design and manufacture are used in many sectors within the semiconductor industry. Their function is to pick up a wafer, hold it, align it, maintain a standard temperature and release the wafer after the processing step without damaging it or contaminating it in a major way.
 
Our portfolio also includes highest precision components, such as high precise mirror blocks and metrology frames with mirrors and measurement surfaces. Our customer-specific light-weight structures with high stiffness and the best flatness allow us to optimize functionality for dynamic processes in the production of semiconductors.
 
You can find specifications about the chuck solutions developed in Berlin under Chuck Design.

Electro­static Chucks

We provide electrostatic chucks for wafers up to 450 mm in diameter with customer-specific designs made from various materials. The ESCs use an electrostatic field under vacuum conditions in order to constrain electrically conductive substrates (e. g. silicon wafers) as well as glass. You can find more information about our development expertise in the chuck design section.

 

Specifications & Properties

Size / geometry

up to 450 mm (18 inches)

Materials Metals (aluminium with coating), ceramics (SiC, SiSiC, AlN, Si3N4, Al2O3, cordierite), glass and ceramics (borosilicate, quartz glass, ULE®, Zerodur®)
Design Customer-specific (e. g. light-weight structure, interior cooling channels, heating filaments ...)
Electrode design Monopolar, bipolar, customer-specific structures (e. g. finger structure)
Surface structuring Customer-specific pin & seal designs (optimized flatness/contact surface upon request)
Flatness Global flatness: up to 100 nm PV (D=298 mm)
Local flatness: up to 10 nm (20x20 mm2)
Warped wafer chucking Absorption of warped wafers and flatten warped wafers up to 5 mm wafer freeform
Shape control Controlled adjustment of wafer shapes possible
Clamping / declamping time up to 0.1 s (depends on clamping length, dielectric, temperature)
Clamping pressure Typically up to 500 mbar
Operational temperature -30 °C bis 600 °C (depends on material)
Surface roughness up to Ra < 1 nm (depends on material)
Tempering / coating Layers for wear protection and/or surface discharge (TiN, CrN, Al2O3, ...) and/or customer-specific coating design

 

Testing & qualification

Geometric testing Interferometer (measurements in stack with substrate) and coordinate measuring machines
Electric testing Capacitiy and high-voltage resistance test
Functional testing Stack measurements, backside gas leakage, resistance tests, residual gas analysis (RGA)
Computer analysis FEA (e. g. modal analysis)

 

For additional information on the technical details and specifications, please refer to our data sheet

Electrostatic Chuck

 

Our electrostatic chucks are used in the following areas:

  • Lithography (EUV, DUV, VIS)
  • Inspection (e-beam)
  • Metrology
  • 3-D-packaging
  • Coating (OLED)
  • Bonding technologies
  • Display manufacture
  • Wafer handling
  • High temperature applications up to 600 C

Vacuum Chucks

We design and manufacture vacuum chucks (up to 450 mm) from various materials like ceramics and glass ceramics for whatever specific application you have. Our vacuum chucks are employed under atmospheric conditions and stand out due to their application-optimized flatness (up to < 100 nm), high holding force, high temperature stability and high stiffness.

 

Specifications & Properties

Size / geometry up to 450 mm (18 inch)
Materials Metals (aluminium with coating), ceramics (SiC, SiSiC, AlN, Si3N4, Al2O3, cordierite), glass and glass ceramics (borosilicate glass, quartz glass, ULE®, Zerodur®)
Design Customer-specific (e. g. light-weight structure, interior cooling channels, heating filament ...)
Vacuum design Multiple and separated vacuum segments available
Surface structuring Customer-specific pin & seal designs (optimized flatness/contact surface upon request)
Flatness Global flatness: up to 100 nm PV (D=298 mm)
Local flatness: up to 10 nm (20x20 mm2)
Warped wafer chucking Absorption of warped wafers and flatten warped wafers up to 5 mm wafer freeform
Shape control Controlled adjustment of wafer shapes possible
Clamping pressure up to 1 bar
Operational temperature -30 C to 600 C (depends on material)
Surface roughness up to Ra <1 nm (depends on material)
Tempering / coating Layers for wear protection particle reduction (TiN, CrN, DLC, SiC) and/or customer-specific layer designs

 

Testing & qualification

Geometric testing Interferometer (measurements in stack with substrate) and coordinate measuring machines
Functional testing Stack measurements, resistance tests, leakage tests, residual gas analysis (RGA)
Computer analysis FEA (e. g. modal analysis)

 

 

We can also integrate cooling and heating functions as well as light-weight structures upon request.

Our vacuum chucks are used in the following areas:

  • Lithography
  • Inspection
  • Metrology
  • Bonding technologies
  • Wafer handling

Precision Components

Berliner Glas produces structural precision components with CNC techniques and offers many different options to shape glass, glass ceramics and ceramics. These structural precision components provide excellent stiffness, the best flatness and individual light-weight structures.

This process allows us to create, with the highest degree of accuracy, contours made up of lines, curves or other arbitrary shapes that run together. This opens new pathways in functional design. We are also able to conduct the high precise installation work for fixtures on these structural components using our expansive experience and expertise in installation and tool design.

 

Mirror and measurement surfaces

High precise mirror blocks and metrology frames with mirror and measurement surfaces allow us to precisely determine the position of components.

Light-weight designs provide considerably better performance in dynamic processes.

Weight reduction by light-weight structures

Weight reduction via light-weight structures

Specifications

Size / geometry Max. 2,100 x 1,800 x 1,200 mm
Materials Glass ceramics (e. g. Zerodur), cordierite. SiSiC, borosilicate glass, quartz glass
Flatness

Global flatness: up to 200 nm PV (800x800 mm)

Local flatness: up to 2 µrad (26x32 mm2)

Reflectivity of the mirror layers Up to >95 %
Squareness of the mirror surfaces Up to 5 µrad
Design Light-weight, installation of fixtures (adhesive, optical contact bonding, anodic bonding)

 

Test & qualification

Geometric testing Interferometer (e. g. mirror surfaces) and coordinate measuring machines
Computer analysis FEA (e. g. modal analysis)

 

Contact our specialists

Please choose your contact partner:

Kontakt Halbleiterindustrie
Sven Götze
Semiconductor Industry
Fon +49 30 60 905-4818
Kontakt zu Berliner Glas
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Downloads

Data sheet

Vacuum Chuck

Data sheet

Electrostatic Chuck

Data sheet

Structural Components

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You can revoke the use of your data anytime via email to marketing@berlinerglas.de, via fax, or via post. If you have any other questions, you can reach our data protection staff at datenschutz@berlinerglas.de.

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Berliner Glas KGaA Herbert Kubatz GmbH & Co.
Waldkraiburger Straße 5
12347 Berlin, Germany

Fon +49 30 60 905-0
info [at] berlinerglas.de

 

Contact details